By A. Fletcher
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Extra resources for Advanced Organics for Electronic Substrates and Packages
Reports from the Netherlands indicate that the production and consumption of engineering and high performance plastics in the Netherlands has remained unchanged for three years. It is estimated that the combined electrical and electronics industries account for 17% of the outlets for all types of new materials in European markets; automotive products account for 25%. The market figures for engineering plastics in Japan are also depressed and demand in 1991 has been affected by a slump in the automotive and electronics industries.
A sheet of pre-preg is glass cloth impregnated with epoxy resin and partially cured by exposure to heat. This exposure initiates a chemical reaction that causes the resin to partially harden. Very complex structures can be obtained from multilayer PCBs. The Thermal Conduction Module (TCM) board produced by IBM requires more than 350 manufacturing operations; it measures 700 x 600 mm and has nearly one kilometre of printed circuit wires -250 000 circuits - throughout its 20 distinct layers. With such complex boards the circuit lines are thinner, the vias are smaller and connector systems change.
Similarly there are three types of polymer used as negative electron resists. The first type is an epoxide containing polymer such as epoxidised poly (butadiene), poly(glycidyl methacrylate) and poly(glycidyl methacrylate-co-ethyl acrylate). Polystyrene is an example of the second type of high resolution negative resist with high dry etch resistance and acceptable stability but low sensitivity. Improvements in the sensitivity have been extensivly investigated using chlorine-containing polystyrenes.
Advanced Organics for Electronic Substrates and Packages by A. Fletcher